Thermal conductivity 24, thermal expansion 12
其他作者:
Gaal, Peter S.
,
Apostolescu, Daniela E.
,
Anter Corporation (Pittsburgh, Pa.)
出版:
Lancaster, Pa. : Techmonic ©1999.
稽核項:
1 online resource (xvii, 806 pages) :illustrations.
標題:
Matériaux
,
Conduction
,
Materials Thermal properties -- Congresses.
,
Chaleur
,
Matériaux Propriétés thermiques -- Congrès.
,
SCIENCE Mechanics -- Thermodynamics.
,
Electronic books.
,
Conduction.
,
Thermal properties.
,
MechanicsThermodynamics.
,
Heat
,
Heat Conduction -- Congresses.
,
Solides
,
Solids Thermal properties -- Congresses.
,
Materials Thermal properties.
,
Solides Propriétés thermiques -- Congrès.
,
SCIENCE
,
Thermal properties
,
Solids
,
Materials
,
Propriétés thermiques
,
Chaleur Conduction -- Congrès.
,
Heat Conduction.
,
Conference papers and proceedings.
,
Solids Thermal properties.
ISBN:
058534955X , 9780585349558
ISBN:
1566767113
試查全文@TNUA:
附註:
Proceedings of the Joint twenty-fourth and twelfth International Thermal Conductivity and Thermal Expansion Conferences, sponsored by the Anter Corporation, held October 26-29, 1997, in Pittsburg, Pennsylvania.
Includes bibliographical references and indexes.
電子資源:
https://dbs.tnua.edu.tw/login?url=https://search.ebscohost.com/login.aspx?direct=true&scope=site&db=nlebk&AN=23827
系統號:
005293606
資料類型:
電子書
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