Microvias :for low cost, high density interconnects
- 作者: Lau, John H.
- 其他作者: Lee, S. W. Ricky.
- 出版: New York : McGraw-Hill 2001.
- 稽核項: 1 online resource (xxiii, 565 pages) :illustrations.
- 叢書名: Electronic Packaging and Interconnection Ser.
- 標題: Junctions. , Printed circuits. , TECHNOLOGY & ENGINEERING , Semiconductors , Electronic books. , ElectronicsDigital. , ElectronicsMicroelectronics. , Semiconductors Junctions. , Microelectronic packaging. , Design and constructionCost control. , TECHNOLOGY & ENGINEERING Electronics -- Digital. , Integrated circuits Design and construction -- Cost control. , TECHNOLOGY & ENGINEERING Electronics -- Microelectronics. , Integrated circuits
- ISBN: 0071382992 , 9780071382991
- ISBN: 9780071455794 , 0071455795 , 0071363270 , 9780071363273 , 1280913363 , 9781280913365 , 7136320070 , 9787136320073
- 試查全文@TNUA:
- 附註: Includes bibliographical references and index.
- 摘要: A guide to microvias technology. It covers technology basics, design methods, heat concerns and developments, and surveys companies and products. Microvias products are essential to small mobile phones and other handheld electronic products, otherwise they would be twice their current size.
- 電子資源: https://dbs.tnua.edu.tw/login?url=https://search.ebscohost.com/login.aspx?direct=true&scope=site&db=nlebk&AN=60056
- 系統號: 005297020
- 資料類型: 電子書
- 讀者標籤: 需登入
- 引用網址: 複製連結
State-of-the-art introduction to high-density interconnect technology The first-ever book on this hot topic, Microvias: Low Cost, High Density Interconnects gives you a thorough look at the technology that’s changing the nature of printed circuit boards--and driving the mobile electronic revolution. A "must" for electronics and mechanical engineers, John Lau and Ricky Lee’s intensive introduction to microvia technology expertly covers all major techniques. You get important details on mechanical NC drilling, laser drilling, photo-defined, chemical and plasma etching, and conductive ink formation. You also get a survey of the work of leading companies and their products, including Canon, Compaq, Fujitsu Limited, Gore, Hitachi Chemical Co., Ibiden, IBM, JCI, JVC, K&S (X-Lam), Kyocera/JME, Matsushita, Mitsubishi, NEC, Samsung, Sheldahl, Shinko, Toshiba.
來源: Google Book
來源: Google Book
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