附註:Includes bibliographical references and index.
Cover -- Contributors -- Foreword -- Preface -- Acknowledgments -- Table of Contents -- Chapter 1. What is Electrometallurgy -- 1.1 Further Readings -- Chapter 2. Definitions, Principles and Concepts -- 2.1 Basic Facts -- 2.2 Self Driving Cells -- 2.3 Electrolysis -- 2.4 Some Aspects of Electrocrystallization -- 2.5 Conclusions -- 2.6 Further Readings -- Chapter 3. Surface Morphology of Metal Electrodepositsts -- 3.1 Thin Compact Surface Metal Films -- 3.2 Thick Compact Metal Electrodeposits -- 3.3 Disperse Deposits -- 3.4 Further Readings -- Chapter 4. The Current Distribution in Electrochemical Cells -- 4.1 Two Equal Plane Parallel Electrodes Arrangement -- 4.2 Cells with Low Anode Polarisation -- 4.3 Corner Weakness Phenomena in Electroforming -- 4.4 Conclusions -- 4.5 Further Readings -- Chapter 5. Electrodeposition at a Periodically Changing Rate -- 5.1 Basic Definitions -- 5.2 Surface Concentration of Depositing Ions in the Periodic Condition -- 5.3 Prevention of the Formation of Spongy Deposits and the Effect on Dendritic Particles -- 5.4 Compact Deposits -- 5.5 Current Density and Morphology Distribution on a Macroprofile -- 5.6 Conclusions -- 5.7 Further Readings -- Chapter 6. Electrowinning -- 6.1 Theoretical Aspects of Electrowinning -- 6.2 Theoretical Aspects of Zinc Electrowinning -- 6.3 Further Readings -- Chapter 7. Electrorefining -- 7.1 Theoretical Aspects of Electrorefining -- 7.2 Theoretical Aspect of Copper Electrorefining -- 7.3 Further Readings -- Chapter 8. Optimum Conditions for Electroplating -- 8.1 Cementation and Deposition from the Complex Salt Solutions -- 8.2 The Porosity of Metal Electrodeposits -- 8.3 The Condition for the Deposition of a Coating with a Minimum Porosity -- 8.4 Further Readings -- Chapter 9. Electroplating And Surface Finishing -- 9.1 Electrodeposition of Alloys -- 9.2 Electrodeposition of Composite Materials -- 9.3 Electroforming -- 9.4 Electroplating from Non-Aqueous Electrolytes -- 9.5 Electroplating from Room Te
摘要:This book begins with a thorough background of the subject. Next, the authors discuss the significance of electrometallurgy within the broader spectrum of science and technology. They then expand the previously laid theoretical base and explain mechanisms of metal deposition and applications for all existing related technologies. The book will be of interest to undergraduate and graduate students involved with electrochemistry of metals, materials science, plating technologies, electronics materials and other fields. Scientists and engineers working in a variety of industries in addition to electrometallurgical process plants will find it an invaluable reference as it provides a thorough background of electrometallurgy, then explores the more advanced mechanisms of metal deposition in a logical manner.
