附註:Includes bibliographical references and index.
Preliminaries -- TABLE OF CONTENTS -- Acknowledgements -- CHAPTER 1: Hybrids vs MMICs -- CHAPTER 2: Basic Concepts -- CHAPTER 3: Planar Waveguides -- CHAPTER 4: Current Flow and Loss Considerations -- CHAPTER 5: Substrates -- CHAPTER 6: Thick Film -- CHAPTER 7: Thin Film -- CHAPTER 8: Dielectric Deposition -- CHAPTER 9: Polymers -- CHAPTER 10 Processing Strategies -- CHAPTER 11: Photolithography -- CHAPTER 12: Electroplating -- CHAPTER 13: Etching -- CHAPTER 14: Components -- CHAPTER 15 Packaging -- CHAPTER 16: Superconductivity -- CHAPTER 17: MEMS
APPENDIX A: Definition of symbolsAPPENDIX B: Company directory -- APPENDIX C: Conversion table -- APPENDIX D: Graphic evaluation ofw/h and for microstrip -- SUBJECT INDEX
摘要:The text begins with an introduction to hybrid technology and basic high frequency principles. Following these, the major forms of transmission waveguide are discussed, and then current flow and loss considerations. Substrates, thick and thin film deposition, polymers, artwork, masks, photolithography, subtractive, additive and semi-additive methods, electro- and electroless plating and etching are covered. Passive and transmission line components are then treated within the confines of process requirements. With this background established, the text is directed toward the effects of processing and materials on passive and transmission line-based components. Packaging is discussed with emphasis on inductance considerations.
