Materials science of thin films :deposition and structure

• 作者: Ohring, Milton,
• 出版: San Diego, CA : Academic Press 2002.
• 版本: 2nd ed.
• 稽核項: 1 online resource (xxi, 794 pages) :illustrations.
• 標題: TECHNOLOGY & ENGINEERING , TECHNOLOGY & ENGINEERING Electronics -- Solid State. , ElectronicsSemiconductors. , Couches minces. , Thin films. , Electronic books. , ElectronicsSolid State. , TECHNOLOGY & ENGINEERING Electronics -- Semiconductors.
• ISBN: 0080491782 , 9780080491783
• ISBN: 9780125249751 , 0125249756
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• 附註: Foreword to First Edition -- Preface -- Acknowledgments -- A Historical Perspective -- Chapter 1 A Review of Materials Science -- 1.1. Introduction -- 1.2. Structure -- 1.3. Defects in Solids -- 1.4. Bonds and Bands in Materials -- 1.5. Thermodynamics of Materials -- 1.6. Kinetics -- 1.7. Nucleation -- 1.8. An Introduction to Mechanical Behavior -- 1.9. Conclusion -- Exercises -- References -- Chapter 2 Vacuum Science and Technology -- 2.1. Introduction -- 2.2. Kinetic Theory of Gases -- 2.3. Gas Transport and Pumping -- 2.4. Vacuum Pumps -- 2.5. Vacuum Systems -- 2.6. Conclusion -- Exercises -- References -- Chapter 3 Thin-Film Evaporation Processes -- 3.1. Introduction -- 3.2. The Physics and Chemistry of Evaporation -- 3.3. Film Thickness Uniformity and Purity -- 3.4. Evaporation Hardware -- 3.5. Evaporation Processes and Applications -- 3.6. Conclusion -- Exercises -- References -- Chapter 4 Discharges, Plasmas, and Ion-Surface Interactions -- 4.1. Introduction -- 4.2. Plasmas, Discharges, and Arcs -- 4.3. Fundamentals of Plasma Physics -- 4.4. Reactions in Plasmas -- 4.5. Physics of Sputtering -- 4.6. Ion Bombardment Modification of Growing Films -- 4.7. Conclusion -- Exercises -- References -- Chapter 5 Plasma and Ion Beam Processing of Thin Films -- 5.1. Introduction -- 5.2. DC, AC, and Reactive Sputtering Processes -- 5.3. Magnetron Sputtering -- 5.4. Plasma Etching -- 5.5. Hybrid and Modified PVD Processes -- 5.6. Conclusion -- Exercises -- References -- Chapter 6 Chemical Vapor Deposition -- 6.1. Introduction -- 6.2. Reaction Types -- 6.3. Thermodynamics of CVD -- 6.4. Gas Transport -- 6.5. Film Growth Kinetics -- 6.6. Thermal CVD Processes -- 6.7. Plasma-Enhanced CVD Processes -- 6.8. Some CVD Materials Issues -- 6.9. Safety -- 6.10. Conclusion -- Exercises -- References -- Chapter 7 Substrate Surfaces and Thin-Film Nucleation -- 7.1. Introduction -- 7.2. An Atomic View of Substrate Surfaces -- 7.3. Thermodynamic Aspects of Nucleation -- 7.4. Kinetic P Includes bibliographical references and index. A review of materials science -- Vacuum science and technology -- Thin-film evaporation processes -- Discharges, plasmas, and ion-surface interactions -- Plasma and ion beam processing of thin films -- Chamical vapor deposition -- Substrate surfaces and thin-film nucleation -- Epitaxy -- Film structure -- Characterixation of thin films and surfaces -- Interdiffusion, reactions, and transformations in thin films -- Mechanical properties of thin films.
• 摘要: This is the first book that can be considered a textbook on thin film science, complete with exercises at the end of each chapter. Ohring has contributed many highly regarded reference books to the AP list, including Reliability and Failure of Electronic Materials and the Engineering Science of Thin Films. The knowledge base is intended for science and engineering students in advanced undergraduate or first-year graduate level courses on thin films and scientists and engineers who are entering or require an overview of the field. Since 1992, when the book was first published, the field of thin films has expanded tremendously, especially with regard to technological applications. The second edition will bring the book up-to-date with regard to these advances. Most chapters have been greatly updated, and several new chapters have been added.
• 電子資源: https://dbs.tnua.edu.tw/login?url=https://search.ebscohost.com/login.aspx?direct=true&scope=site&db=nlebk&AN=92177
• 系統號: 005321167
• 資料類型: 電子書
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