Substrate noise coupling in mixed-signal ASICs

  • 其他作者: Donnay, Stéphane. , Gielen, Georges.
  • 出版: Boston : Kluwer Academic Publishers ©2003.
  • 稽核項: 1 online resource (xxxi, 287 pages) :illustrations.
  • 標題: Electronic circuits Noise. , TECHNOLOGY & ENGINEERING , TECHNOLOGY & ENGINEERING Electronics -- Circuits -- VLSI & ULSI. , COMPUTERS , TECHNOLOGY & ENGINEERING Electronics -- Circuits -- Logic. , ElectronicsCircuitsVLSI & ULSI. , Mixed signal circuits. , COMPUTERS Logic Design. , Electronic circuits , Application-specific integrated circuits. , ElectronicsCircuitsLogic. , Noise. , Logic Design. , Electronic books.
  • ISBN: 1280608358 , 9781280608353
  • ISBN: 9781402073816 , 140207381X
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  • 附註: Includes bibliographical references. Preliminaries; CONTENTS; Contributors; Foreword; Introduction; Chapter 1: Technology impact on substrate noise; Chapter 2: Substrate noise generation in complex digital systems; Chapter 3: Modeling and analysis of substrate noise coupling; Chapter 4: SPACE for substrate resistance extraction; Chapter 5: Models and parameters for crosstalk simulation; Chapter 6: High-level simulation of substrate noise generation in complex digital systems; Chapter 7: Modeling the impact of digital substrate noise on analog integrated circuits. Chapter 8: Measuring and modeling the effects of substrate noise on the LNA for a CMOS GPS receiverChapter 9: A practical approach to modeling silicon-crosstalk in systems-on-silicon; Chapter 10: The reduction of switching noise using CMOS current steering logic; Chapter 11: Low-noise digital design techniques; Chapter 12: How to deal with substrate bounce in analog circuits in epi-type CMOS technology; Chapter 13: Reducing substrate bounce in CMOS RF-circuitry.
  • 摘要: The purpose of Substrate Noise Coupling in Mixed-Signal ASICs is to provide an overview of very recent research results in the field of substrate noise analysis and reduction techniques. Much of the reported work has been established as part of the Mixed-Signal Initiative of the European Union. It is a representative sampling of the current state of the art in this area. All the different aspects of the substrate noise coupling problem are covered. Some chapters describe techniques to model and reduce the digital switching noise injected in the substrate. Other chapters describe methods to analyse the propagation of the noise from the source (the digital circuitry) to the reception point (the embedded analog circuitry) through the substrate considered as a resistive/capacitive mesh. Finally, the remaining chapters describe techniques to model and especially to reduce the impact of substrate noise on the analog side. This is illustrated with several practical design examples and measurement results.
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  • 系統號: 005322478
  • 資料類型: 電子書
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